Grid, generation and electrical systems
Interconnection, substations, switchgear, transformers, UPS, BESS, gas turbines, busways, PSUs and 800VDC.
Future hinge: time-to-powerChip-to-campus thermal systems
Cold plates, manifolds, CDUs, facility water, chillers, towers, filtration and operational failure modes.
Future hinge: rack densityNetworking, optics and connectivity
Scale-up, scale-out, DCI, Ethernet, InfiniBand, RoCE, copper, transceivers, silicon photonics, LPO and CPO.
Future hinge: bandwidth economicsStorage, HBM and KV infrastructure
HBM, NAND, SSD, HDD, object storage, checkpointing, caching and data movement across the AI pipeline.
Future hinge: data gravityThe system is the unit of compute
Rack architecture, power shelves, serviceability, advanced packaging, chiplets, boards, cables and mechanical constraints.
Future hinge: rack-scale designBuilding the AI factory
EPC, commissioning, modularization, powered land, leasing, vendor qualification, construction sequencing and risk.
Future hinge: deployment velocityFrom utility feed to accelerator heat.
Electrical delivery and thermal removal are coupled systems.
Power chain
Cooling loop
Density transition
Air → hybrid → direct liquid → rack-scale liquid.
What leaders need to decide now.
The highest-value infrastructure decisions are made years before the workload arrives. Metachips frames each transition around timing, dependencies, qualification and option value.